Copper (Cu) target are sputtered under vacuum to form layers in the manufacture of TP, semiconductors, sensors, circuit devices and decorations etc.
Symbol | : | Cu |
Purity | : | 4N+ |
Form | : | Planar; Rotary |
Color / Appearance | : | Reddish-orange, metallic |
Typical Density | : | 8.57g/cm3 |
Typical Dimension | : | Planar: D500mm Rotary: L4000mm Other dimensions available |